B. According to the process, technology can be divided into:
a. Aluminum extruded heat sink:
This is an excellent heat dissipation material widely used in modern heat dissipation. Most of the industry uses 6063 T5 high-quality aluminum materials. Its purity can reach more than 98%. It has strong thermal conductivity, low density, and low price. It has been obtained by major manufacturers. Favored. Based on the thermal resistance values of Intel and AMD CPUs and their calorific value, aluminum extrusion manufacturers formulate corresponding molds, heat the aluminum ingots to a certain temperature to change their physical form, and then get them out of the mold all kinds of extruded aluminum heatsink materials we want; then they can be used by cutting, grooving, sanding, deburring, cleaning, and surface treatment.
b. Aluminum casting heat sink:
Although the price of aluminum extruded fins is low and the manufacturing cost is low, it is limited by the soft texture of aluminum itself. The ratio of the thickness of its fins to the height of fins generally does not exceed 1:18, so each As PC manufacturers continue to increase the heat dissipation area and the heat dissipation space remains unchanged, the manufacturers have proposed a more suitable solution to encrypt the fins to increase the number of fins; bend the fins to increase the heat dissipation area; heating the aluminum ingot from the solid-state to the liquid state through the mold, and then cooling it has become the heat sink we want.
c. Aluminum cutting fins:
Although the effect of this type of aluminum extrusion is solved from the heat dissipation area, the precision of the mold now directly affects the overall shape and heat dissipation capacity of our heat sink, so more manufacturers began to think of using precision tools for processing machinery Directly cut the block of the aluminum ingot to the shape we want, so that during the process, neither deformation will occur, nor will various impurities enter the heat sink during the aluminum extrusion process. The heat dissipation area is maximized.
d. Copper cutting heat sink:
After using the aluminum extruded heat sink for a long time, no matter how we change the processing technology, it is difficult to meet the increased heat generation of the CPU. Some manufacturers have to spare no expense in cost and choose aluminum for copper. The thermal conductivity is much greater than aluminum, and the exponential increase in thermal conductivity is of great benefit to our heat dissipation; however, because the hardness of copper is much greater than that of aluminum, it is a severe test for the manufacturing process during processing. Therefore, the traditional extrusion molding process can no longer be applied to copper, and it has to be turned into this cutting method for processing.
e. Aluminum and copper stack heat sink:
One thing that deserves our attention is that cost and profit are always the ultimate goals pursued by manufacturers. Therefore, major manufacturers have come up with more optimized solutions, which are made by folding copper and aluminum sheets. The heat sinks of various shapes we want are then connected with the appropriate bottom plates of various heat sinks by welding, which not only meets our heat dissipation requirements but also speeds up our production progress and makes mass production more easily。
f. Copper aluminum heat sink
g. Copper embedded heat sink:
The most perfect solution for this compromise solution should be the copper embedding technology pioneered by AVC. This is the harmonious unification of the advantages of copper heat conduction speed, high density, and strong heat absorption capacity with the advantages of traditional aluminum extruded light density, cheap price, and convenient mass production;
h. Copper heat sink:
Another solution is that FOXCONN pioneered the use of copper blocks at the bottom of the heat sink that is in contact with the CPU. The use of copper has the characteristics of fast heat absorption and strong thermal conductivity. On the block, the copper block and the aluminum extruded fins are closely combined with a thermal paste, so that a large amount of thermal energy quickly diffuses onto the aluminum extruded fins and is taken away by the rotation of the fan.
i. Slotted heat sink:
Today, with increasing heat dissipation requirements, smart Japanese people began to think of using thin and dense heat dissipation fins and heat dissipation base plates to fit together under huge pressure. This technology can use copper, aluminum fins and copper, aluminum base plate to arbitrarily combine and match, and also effectively avoids the disadvantages of new thermal resistance caused by the uneven thermal conductivity of various solder pastes during the welding process. Make customers have more selectivity and diversity of thermal solutions. However, due to the particularity of its processing, the current mass production still has the problem of the too high cost.
j. Copper-aluminum and heat pipe fitting heat sink:
The heat pipe is a major discovery in the field of heat transfer in recent years, and it is also the first major heat dissipation material used in the heat dissipation of notebook computers and major high-end communications industries. Because of its amazing heat conduction speed and the physical characteristics of recycling, our heat dissipation becomes easier and unlimited possibilities are created.
Although with the continuous upgrading of products, the heat value of the CPU has been greatly reduced compared with the previous heat value. However, the original radiator that only reaches the benchmark heat dissipation level obviously cannot meet the long-term stable work of the computer in the summer. Choosing an Aluminum CPU heat sink with superior performance has become the majority of people before the cool summer installation Issues that must be taken into account.
Aluminum Cpu Heat Sink